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Shannon Davis predominantly covers press releases and private sector announcements within the semiconductor industry, with a focus on consumer electronics and manufacturing. She would likely be interested in pitches around new product launches, technological advancements, or industry reports related to semiconductors, electronics, and manufacturing.
Given her emphasis on press releases and private sector announcements, Shannon may be open to receiving news about company milestones such as certifications or significant appointments within the semiconductor industry.
As Shannon does not have a specific geographic focus but covers an international scope of semiconductor-related topics from various regions across the globe.
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By: Shannon Davis
Taiyo Holdings Co., Ltd., based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the “FPIM Series”, a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL negative-tone i-line photosensitive insulating material for dual damascene processes.
By: Shannon Davis
Samsung Electro-Mechanics will participate in the ‘KPCA Show 2026' (International Semiconductor Substrate & Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, where it will showcase next-generation semiconductor package substrate technologies.
By: Shannon Davis
NY Creates today announced its inclusion in the 12-inch mask industry initiative, a newly formed collaboration designed to strengthen the high numerical aperture extreme ultraviolet (high NA EUV) lithography ecosystem and support the industry's transition toward larger masks that can be used to increase the area in which chip components at the smallest, next-generation nodes can be printed.
By: Shannon Davis
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron
By: Shannon Davis
Kyocera Corporation and the Research Institute of Electrical Communication (RIEC), Tohoku University have developed a new technology for integrating optical isolators onto silicon photonics chips using “laser annealing,” a localized, laser-based heat-treatment method.
By: Shannon Davis
Physical AI is one of the hardest engineering problems the technology industry has faced.
By: Shannon Davis
The National Network for Microelectronics Education (NNME) , a national workforce development initiative supported by the U.S.
By: Shannon Davis
Through this collaboration, Xanadu and ASML will explore lithography-enabled process approaches that may contribute to improved patterning control and lower-loss photonic structures.
By: Shannon Davis
NY Creates (the New York Center for Research, Economic Advancement, Technology, Engineering, and Science) and Micron Technology, Inc., held a signing
By: Shannon Davis
The MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning in a single semiconductor inspection platform. Its proprietary 25MP CoaXPress vision system with 7.7µm resolution precisely inspects 01005 chip arrays, solder balls, bumps, and densely packed packages. The 8-phase coaxial color lighting enhances crack and surface-defect visibility on reflective CSP components, while the blue laser scanner reliably measures highly reflective and low-reflective surfaces.
