Shannon Davis

Micron Technology, Inc. (Nasdaq: MU) today announced an investment in critical minerals processing and high-purity materials manufacturing that is

NTT, Inc. (NTT), NTT Innovative Devices Corporation (NTT Innovative Devices), Japan Semiconductor Corporation (Japan Semiconductor), Furukawa Electric Co., Ltd. (Furukawa Electric), and SHINKO ELECTRIC INDUSTRIES CO., LTD. (Shinko Electric Industries) today announced that a four-company joint R&D proposal led by NTT Innovative Devices has been selected under the New Energy and Industrial Technology Development Organization (NEDO)'s Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufacturing Technologies for Advanced Semiconductors. The project aims to establish mass-production technologies for photonics-electronics convergence (PEC) devices that support next-generation AI and data-intensive computing. The participating companies will jointly develop mass-production technologies for optical chiplets, with NTT serving as an advisor.

Axcelis Technologies, Inc. (Nasdaq: ACLS), a supplier of enabling ion implantation solutions for the semiconductor industry, today announced that it will officially break ground on its new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea. This $35 million investment reflects Axcelis' continued commitment to strengthening its high-volume manufacturing infrastructure and expanding its capacity to serve customers around the world.

Navitas Semiconductor (Nasdaq: NVTS), a leader in next-generation power semiconductors and power delivery solutions, pioneering GaN, high-voltage

Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), SEMI reported today in its annual silicon shipment forecast. Shipments are expected to reach successive record highs from 2027 through 2029, rising to 17,034 MSI by the end of the forecast period.

The Department of Commerce today announced the signing of four letters of intent to provide up to $389 million in federal R&D awards under the CHIPS and Science Act.

Atomera, a semiconductor transistor materials and technology licensing company, today announced it has entered into a Joint Development Agreement (JDA) with

Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component

3D integration, advanced packaging, next-generation memory architectures, and new patterning technologies are emerging as critical enablers of AI computing. Together, they allow chipmakers to break through traditional scaling constraints and deliver the performance gains required for the AI era. In this context, Lam has extended its long-standing strategic collaboration with imec, a world-leading research and innovation center in advanced semiconductor technologies, to include two new joint research and development focuses: enabling advanced 3D integration and advancing Aether® dry resist for future high-NA EUV patterning.

ChipAgents , the category leader in agentic AI platforms for semiconductor design, announced the expansion of its AI-native engineering platform across digital and analog chip design, bringing more of the semiconductor development flow onto a shared agentic foundation.