Chad Cox

Sphere Inc. has said it is expanding the focus within its Platform Reboot to help organizations when it comes to identifying opportunities to replace high-cost SaaS tools and aging business applications with purpose-built software.

SECO announced early sample access for a limited quantity of its SOM-SMARC-Dragonwing-IQ8 hardware allowing the evaluation of the SMARC Rel. 2.1.1 module based on Dragonwing IQ8 Series. The module was engineered as part of the collaboration between SECO, Arduino, and Qualcomm Technologies, Inc. It enables users to move from rapid prototyping to production-oriented architectures for AI-enabled robotics, smart machines, industrial vision, HMI, and machine control.

Renesas Electronics Corporation has officially opened its Physical AI and Robotics Lab in Beijing, China. The lab will facilitate users in demonstrating, validating, and collaborating in the design of next-generation robotic systems. The lab will serve as a center for fulfilling Renesas’ physical AI strategy from proof-of-concept to deployment at scale.

Quantropi will be demonstrating four software-defined, quantum-secure IoT solutions at embedded world North America 2026 in Exhibit Hall B, Booth 6808. The solutions aid embedded device manufacturers as they begin to transition toward quantum-safe security without the need to redesign hardware or replace existing platforms. Offered via the QiSpace platform, the four solutions,

Syslogic announced various IP67/IP69-rated versions of its Rugged Computer RPC RS built on NVIDIA’s new Jetson Orin Nano 2. The platforms will be a gateway into Syslogic’s NVIDIA Jetson portfolio while maintaining the ruggedness and longevity Syslogic is known for. Operating temperature range is –25°C to +70°C.

Toradex announced the Aquila IQ8, its first System on Module (SoM) powered by the Qualcomm Dragonwing IQ-8275 processor. The SoM is ideal for OEMs designing robotics, computer vision, and industrial edge systems, as the module runs demanding edge AI workloads directly on the device.

Analog Devices, Inc. (ADI) and Alif Semiconductor released information that the two companies have come into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion.

Kawasaki Heavy Industries, Ltd. (Kawasaki) and EdgeCortix Inc. announced a Teaming Agreement to advance next-generation AI-enabled aerospace and defense systems. The understanding will create a multi-year strategic program with the initial scope consisting of several million U.S. dollars in aggregate program value from 2026 to 2028. It will combine Kawasaki’s aerospace and defense systems knowledge with EdgeCortix’s advanced AI semiconductor and software technologies.

BIWIN will participate in embedded world North America 2026, where at Booth #6104, the company will highlight its latest innovations across enterprise, embedded, industrial, automotive, and PC OEM storage. BIWIN’s portfolio supports applications in AI, edge computing, intelligent vehicles, and next-generation embedded systems.

Smith will be in Exhibit Hall B, Booth 6426 during embedded world North America 2026 where its onsite experts will have availability to discuss Smith's approach to navigating complex market conditions and procuring critical components for its customers. The company’s customizable and comprehensive solutions will be demonstrated along with its Intelligent Distribution model and its extensive global reach.